Chipmakers consider how to replace dual-damascene copper

01/24/2013 |

Dual-damascene copper interconnects have been a semiconductor manufacturing staple for nearly two decades, Mark LaPedus notes in this article. What chipmakers will use in its place as chip dimensions shrink to 10 nanometers and less is under consideration. "I think dual damascene will extend to 10nm and probably the 7nm node," says IBM's Daniel Edelstein, adding that single damascene and copper reactive ion etching are potential alternatives.

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