Spreadtrum's smartphone chips are going into eWLB packaging

01/24/2013 | DigiTimes

Spreadtrum Communications is having its smartphone semiconductors put into embedded wafer-level ball grid array packages to meet the demand for mobile chipsets in China, according to STATS ChipPAC, Spreadtrum's IC assembly and testing contractor. "By combining our unique chip architecture and leading TD-SCDMA modem technology with STATS ChipPAC's technology and manufacturing leadership, we have been able to deliver high-performance TD-SCDMA chipsets in a package format that continues to provide Spreadtrum and our customers with a clear competitive advantage in the China market," Spreadtrum's Brian Chen said in a statement.

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