Infineon unveils "coil on module" IC package for smart cards

01/29/2013 | EE Times Europe

The new "coil on module" semiconductor packaging from Infineon Technologies is meant to be used in dual-contact smart cards, facilitating contactless payments. "Our 'coil on module' solution enables card manufacturers to ramp up volumes with a simplified production process, better yield and overall lower manufacturing costs than with conventional dual-interface modules," Infineon's Thomas Rosteck said.

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