JEDEC publishes 2 new standards for quality & reliability


JEP170: Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) and JESD226: RF Biased Life (RFBL) Test are both available for free download from the JEDEC website. JEP170 provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications, as well as illustration of other defects. The stress method defined in JESD226 is used to determine the effects of RF bias conditions and temperature on Power Amplifier Modules (PAMs) over time.

Published in Brief: