Xerox PARC develops self-assembling silicon "chiplets"

Xerox's Palo Alto Research Center has developed "chiplets" of silicon that can be assembled into circuits for smartphones or bandages that transmit health data, John Markoff writes. The technology would allow the three-dimensional printing of ICs that could serve as microprocessors, memory chips or microelectromechanical system devices, he notes.

View Full Article in:

New York Times (tiered subscription model), The

Published in Brief: