Graphene composite cools better than copper, researchers report

04/11/2012 | EE Times

Researchers at North Carolina State University have developed a heat spreader with a copper-graphene composite connected to chips by an indium-graphene interface film that they say is 25% faster in dissipating heat than copper-based heat spreaders. By using less copper than conventional heat spreaders, the technology has the potential to provide a less expensive yet more energy-efficient method of keeping ICs cool.

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