TSV technology to be used in 3DIC ambient-light sensors

06/9/2013 | Electronics Weekly (U.K.)

Ambient-light sensors fabricated by ams for smartphone applications are being made with through-silicon vias, a 3DIC technology. "We have been developing the TSV capability and expect to be in production with first sensors in the middle of the year," said Thomas Riener of ams.

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Electronics Weekly (U.K.)

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