Could IC packaging repeal Moore's Law?

06/30/2011 | ElectronicsNews.com.au (Australia)

Moore's Law has been a staple of the electronics industry since its inception, but the rise of mobile devices could lead to a sea change that would give integrated-circuit packaging a greater role in shaping the performance of systems, according to the trade group SEMI. IC packaging has provided low-cost and energy-saving solutions to mobile applications while competing with next-node processing technologies as the mobile platform of choice, SEMI says.

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