IC Insights: 300mm capacity to exceed 70% in 4 years

07/4/2013 | DigiTimes

Measured by shipments of surface area, 300-millimeter wafer production capacity will represent 70.4% of the worldwide semiconductor industry's output in 2017, compared with 56% at the end of last year, according to IC Insights. GlobalFoundries, Intel, Samsung Electronics, Taiwan Semiconductor Manufacturing and Toshiba are all expected to increase their 300mm capacity over the next four years, as less fabrication is done on 200mm wafers, which will account for 21% of global installed capacity in December 2017, down from 32% at the close of 2012, the market research firm forecasts.

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