Samsung turns to 3DIC technology for new mobile flash memory

08/5/2013 | PCWorld

The new V-NAND flash memory devices from Samsung Electronics make use of three-dimensional chip technology, stacking 24 NAND layers in one IC package. Dean McCarron of Mercury Research said, "If you're trying to put a lot of stuff in a package, and you're seeing the scaling laws of process technology coming to their limits, it makes sense to start stacking."

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