3M, IBM are working together on chip-stacking technology

09/7/2011 | Wall Street Journal, The

IBM and 3M are collaborating on stacking chips within a single package, with IBM looking toward stacking 100 microprocessors, memories and other devices in a single package. 3M is developing adhesives that can conduct heat from chips, a key issue in chip stacking, and processes to coat chips in production volumes.

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