450mm equipment phase-in depends on industry funding

09/9/2011 | SemiMD.com

The timing of the semiconductor industry's transition to manufacturing on 450-millimeter wafers will depend on how and when chipmakers and equipment vendors can agree on funding the research and development into the new generation of IC fabrication tools, according to this news analysis. Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. are driving the transition, and they are expected to be among the chipmakers that will build 450mm wafer fabs.

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