TSMC has 3 reference design flows for 16nm FinFETs, 3DICs

09/17/2013 | EE Times

Taiwan Semiconductor Manufacturing said it has three reference design flows, all of which have been through test production in silicon, for 16-nanometer devices with FinFETs and three-dimensional chips. "These reference flows give designers immediate access to TSMC's 16FinFET technology and pave the way to 3DIC Through-Transistor-Stacking (TTS) technology," TSMC's Cliff Hou said.

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