Advanced fabrication capacity to become more scarce

10/4/2011 | Electronics Weekly (U.K.)

As the semiconductor industry begins its transition to manufacturing on 450-millimeter wafers, leading-edge wafer fabrication capacity will become harder to obtain for fabless semiconductor companies, according to Future Horizons. The consulting firm said the combination of less capital investment in 300mm wafer fabs, increased fab utilization and the higher cost of building and equipping new fabs mean leading-edge capacity will be less of a commodity than it is now.

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Electronics Weekly (U.K.)

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