Micron, Samsung join together to boost low-power memory cube

10/6/2011 | Bloomberg · GigaOm · PCWorld

Samsung Electronics joined Micron Technology in forming a group to boost industry adoption of Micron's Hybrid Memory Cube, a low-power memory-stacking technology. The new packaging technology is estimated to operate 15 times faster than a DDR3 memory module while consuming 70% less power per bit than DDR3 memory. Altera and Xilinx have also joined the Hybrid Memory Cube Consortium.

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Bloomberg · GigaOm · PCWorld

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