Through-silicon vias to enable 3D chip technology

10/19/2011 | Electronics Weekly (U.K.)

Through-silicon via interconnects are emerging as the most practical way to realize 3D chip stacking, writes Richard Wilson in this news analysis. The Hybrid Memory Cube technology being championed by Micron Technology and Samsung Electronics uses DRAM die linked by TSV interconnects, he notes.

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Electronics Weekly (U.K.)

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