TI considers 3D-chip packaging technology

10/21/2011 | Electronics Weekly (U.K.)

Texas Instruments is actively considering the use of through-silicon via interconnects in packaging its processors. The 3D-chip technology allows companies to do away with wire bonding to connect chips. "The big gain with TSVs is the memory bandwidth it can give you," said Avner Goren, general manager of TI's OMAP processor platform business.

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Electronics Weekly (U.K.)

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