Foundries to make analog, power management ICs on 300mm wafers

11/7/2011 |

While most analog and power-management chips are being fabricated on 200-millimeter silicon wafers, some silicon foundries are joining integrated device manufacturers in manufacturing those parts on 300mm wafers, this analysis notes. At the same time, chipmakers are implementing smaller dimensions in power management ICs, moving beyond the 0.35-micron processes that are standard throughout the industry.

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