Robatech offers confectionery packaging innovations

12/5/2011 | Packaging Europe (U.K.)

Robatech showcased several technologies for hotmelt adhesives used in confectionery packaging at the ProSweets Cologne 2012 exhibit. These include the SpeedStar Diamond, which can place as many as 800 dots of adhesive per second; and the Concept Diamond, which promises energy savings.

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Packaging Europe (U.K.)

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