Sematech identifies challenges in 3D chip technologies

12/22/2011 | EE Times Asia (free registration)

Sematech's 3D Enablement Center has worked with the Semiconductor Research Corp. and the Semiconductor Industry Association to identify technical challenges in 3D ICs. Once those challenges can be overcome, 3D chips could provide significant advances in communication switches, heterogeneous computing, imaging and smart sensor systems, some experts agree.

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