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JEDEC SmartBrief

Daily updates about the evolution of microelectronics

JEDEC SmartBrief

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Samsung ramps up TSV-based DDR4 DRAM module production

8/27/2014

  • Yonhap News Agency (South Korea) (subscription required)

Samsung Electronics reports it has initiated volume production of DDR4 DRAM modules employing through-silicon via technology. "While chips had to be connected to memory controllers through cords under… Read More