Semiconductors
Top stories summarized by our editors
5/21/2018

Revolution Computing's Revolver chip will be able to boost x86 server performance by 10 times or more, providing a capable solution for fraud detection, ad matching, predictive maintenance and other functions across a variety of industries, the startup claims. Revolution is using a version of co-founder Mikko Lipasti's Predictive High-Performance Architecture Research Mavens technology.

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EE Times
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Revolution Computing
5/21/2018

Arduino has unveiled Uno WiFi Rev 2, its inaugural development board to feature integrated Wi-Fi, at Maker Faire Bay Area 2018. The company also debuted its MKR Vidor 4000 board, which features a field-programmable gate array.

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VentureBeat
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Arduino
5/21/2018

Demand for 200-millimeter chips is unlikely to let up, leaving 200mm fab capacity tight throughout 2018 and possibly into 2019, writes Mark Lapedus. Samsung, GlobalFoundries, Semiconductor Manufacturing International Corp. and other manufacturers are working to boost 200mm capacity, but it may not be enough to meet demand and fab equipment is still difficult to obtain, Lapedus writes.

5/18/2018

Chinese regulators have approved the sale of a majority stake in Toshiba's microchip business to a consortium led by Bain Capital. Toshiba confirmed that it has collected "all required antitrust approvals" for the sale.

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Toshiba, Bain Capital
5/18/2018

Foundries are expanding 200-millimeter radio-frequency silicon-on-insulator technology fab capacities in response to growing demand, while GlobalFoundries, TowerJazz, Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. are focusing on 300mm RF SOI fab processes. Original equipment manufacturers are adding more RF components in smartphones, leading to higher demand that is currently outpacing supply in the RF SOI supply chain, writes Mark Lapedus.

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Mark LaPedus, TSMC
5/18/2018

Taiwan's strategy of sending promising individuals in high-tech industries to the US and other nations to study and learn new skills has helped the country keep up with the fast pace of the semiconductor industry, reports the Minister of Science and Technology Liang-Gee Chen. "For rising stars to be born in Taiwan, we need to create opportunities where our young people can build connections with companies in different countries," Chen says.

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EE Times
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Chen
5/18/2018

Tsinghua Unigroup will partner with the Tianjin government to construct a $1.88 billion headquarters for its cloud business in the Chinese city. Meanwhile, the company has started construction on a chip and cloud center in northwestern China.

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DigiTimes
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Tsinghua Unigroup
5/18/2018

Dialog Semiconductor's GreenPAK configurable mixed-signal IC solutions help designers easily change circuit layouts and handle testing, said Mark Tyndall, general manager of Dialog's emerging business group.

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DigiTimes
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Dialog Semiconductor
5/18/2018

The Lenovo Ideapad 330 will be the first products to feature Intel's 10-nanometer processors. The 10nm chip boasts 4 megabytes of smart cache, supports up to 32 gigabytes of memory and includes two cores.

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ZDNet
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Lenovo, Intel
5/18/2018

The fully depleted silicon-on-insulator process offer lower design costs and fewer masks to provide design optimization while allowing for radio frequency integration on the same chip, said GlobalFoundries Chief Technology Officer Gary Patton. FD-SOI doesn't compete with finFET, as "planar devices are far superior to finFET devices in RF," said Patton.

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Gary Patton, FinFET