Semiconductors
Top stories summarized by our editors
2/15/2018

Qualcomm is sampling the Snapdragon X24 LTE modem, fabricated with a 7-nanometer process. The chip, capable of supporting download speeds of up to 2 gigabits per second, will go into volume production by the end of this year.

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New Electronics
2/15/2018

Researchers in Germany report developing a three-level drive with a full bridge of low-voltage transistors to enhance the performance of gallium nitride power transistors. The work was described in a paper presented at the International Solid-State Circuits Conference.

2/15/2018

Jim Handy of Objective Analysis looks at the basics of nonvolatile dual in-line memory modules and explains why NVDIMMs are in great demand for data storage. JEDEC has designated three types of NVDIMMs -- NVDIMM-N, NVDIMM-F and NVDIMM-P -- and the NVDIMM-N type is offered by a number of vendors, he notes.

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Electronic Design
2/14/2018

In KPMG's annual survey of 150 semiconductor industry leaders, nearly two-thirds said the internet of things will be a key driver of chip sales in 2018, compared with 56% last year. Artificial intelligence and cloud computing were each identified by 43% of the respondents, up from 18% for AI and 27% for cloud in 2017, while wireless communications remained the top application, with 75% in 2017.

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VentureBeat
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KPMG
2/14/2018

Tsinghua Unigroup, the city of Chongqing, China, and Sino IC Capital have established an investment firm with $15.8 billion in registered capital, with a plan to spend up to $100 billion in the next decade in expanding Tsinghua Unigroup's semiconductor operations. Tsinghua Unigroup is currently developing an industrial park in Chongqing, budgeting $9.46 billion for the project.

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Tsinghua Unigroup
2/14/2018

MIT researchers report development of a public-key encryption chip that is said to be significantly more power-efficient while using less memory and running faster. The hardwired chip would enable internet of things devices to encrypt their data without software execution.

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New Electronics
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MIT
2/14/2018

Arm brought out its Project Trillium machine learning platform, which combines processors and sensors to enhance artificial intelligence technology in mobile devices at the network's edge. The company designed a high-end processor to make machine learning calculations.

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VentureBeat, Quartz
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ARM
2/14/2018

The reliability of microchips designed for automotive electronics, cloud computing and the industrial internet of things can degrade over a period of years, this analysis notes. Arm CEO Simon Segars says, "Aging is a function of clock speed and power, but in the past, the servers would come on occasionally when there was a job to do, and they sat idle most of the time."

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CEO Simon Segars
2/14/2018

The National Chiao Tung University in Taiwan will collaborate with the Indian Institutes of Technology on research that could see more Indian students studying and working in Taiwan. Their contract calls for 200 dual-degree doctoral students and 60 bachelor's and master's degree students from India to go to the NCTU each year.

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DigiTimes
2/13/2018

The worldwide DRAM market's output value is expected to reach $96 billion this year, a more than 30% year-over-year gain, DRAMeXchange predicts, after 2016's growth of 76%. The market research outfit estimates the output value of DRAMs in the fourth quarter of 2017 was nearly $21.9 billion, up 14.2% from the third quarter, due to seasonal demand for smartphones and increasing prices for mobile DRAM.

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DigiTimes