| News for and about the microelectronics industry |  |
| Today's Tech Buzz |  |  |
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- Report: MediaTek develops 8-core apps processor for ZTE
MediaTek is said to be crafting an eight-core applications processor for a ZTE smartphone, Peter Clarke writes, citing reports in Taiwan. The MT6599 processor is supposedly based on ARM Holdings designs and will be fabricated by Taiwan Semiconductor Manufacturing with a 28-nanometer process, China Times reports. EE Times
(11/27)     
| ICs, Memory & More | | |
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- Nvidia takes GPU market share from Intel, AMD, firm says
Nvidia shipped 22.25 million graphics processing units for PCs in the third quarter, up 19.6% from the second quarter and representing a revenue market share of 18.5%, compared with 14.8% in Q2, according to Jon Peddie Research. At the same time, Intel shipped 71.75 million PC GPUs, down 8% from the prior quarter, for a market share of 59.8%, lower than Q2's 62.2%. Advanced Micro Devices shipped 25.43 million units, down 10.7% from Q2, for a Q3 market share of 21.2%, compared with Q2's 22.7%, the market research firm estimated. eWeek
(11/26)
- Sources: NAND flash makers prepare for transition to 16nm process
Manufacturers of NAND flash memory devices will be implementing a 16-nanometer process next year, DigiTimes reports, citing industry sources. Volume production of 16nm flash memory chips may be delayed due to yield problems, those sources said. NAND flash suppliers are currently turning out memories with features of 19nm or 20nm. DigiTimes
(11/26)
| Going Green | | |
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- Scientists turn to the human body to provide energy sources
Researchers around the world are coming up with novel ways to power medical devices by drawing energy from the heat, movement and sound of the human body, this analysis notes. Blood flow, heart beats and lung contractions may also be employed in the nascent field of bioenergy harvesting, which could produce human-powered medical devices within 10 years, it was said. The Wall Street Journal
(11/26)
- Resistivity in CNT interconnects reduced at Georgia Tech
Researchers at the Georgia Institute of Technology have come up with graphitic nanojoints that can significantly reduce resistivity in connections between carbon nanotubes and metal junctions. The method, which employs electron beam-induced deposition, might make carbon nanotubes more suitable as high-speed interconnects in ICs made from carbon and silicon. EE Times India (free registration)
(11/27)
| Semiconductors in Action | | |
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- Will Intel make it harder for users to replace CPUs?
Intel is reportedly considering putting its future Broadwell processors into ball-grid array packages rather than the customary land-grid array packages for desktop PC processors, which would make it more difficult for computer users to swap out processors in motherboards, the PC Watch website reports. Intel did not comment on the report. Bit-Tech.net
(11/27)
| Testing & Standards | | |
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| JEDEC News | | |
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Now is the time to join JEDEC for 2013
As members of an open standards organization with global participation, JEDEC member companies enjoy technological insight, competitive advantage and influence. One of JEDEC's core values is its ability to develop standards spanning the breadth of the microelectronics industry: from components to packaging, test methods and quality and reliability, JEDEC standards address the needs of all segments of the industry, from device manufacturers to end consumers. JEDEC's low cost of membership allows companies of all sizes and revenue levels to participate, resulting in consensus-based standards with broad industry acceptance. Find out more and join today.
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JEDEC and ONFI publish NAND flash interface interoperability standard
JEDEC and the Open NAND Flash Interface Workgroup (ONFI) have announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both www.jedec.org and www.onfi.org.
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