5/4/2010

DuPont, Dow Corning and BASF have released products into the expanding solar market, including solar encapsulants, which are needed for module sealing and integration. DuPont has partnered with Oerlikon Solar to develop an ultra-thin photovoltaic encapsulant sheet, and Dow Corning and Reis Robotics are promoting an encapsulant series that can replace ethyl vinyl acetate resins traditionally used in encasing solar cells.

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ICIS News (U.K.)

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