12/9/2011

Semiconductor manufacturers such as IBM and Micron Technology are developing a variety of 3D DRAM technologies that involve stacking chips together to increase performance. While commercial availability of such parts is still a way off, a number of promising developments have come to the fore. "This is a new DRAM market that will develop with the availability of proven product, production availability and volume pricing," said Sherry Garber, an analyst with Convergent Semiconductors.

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