STMicroelectronics has introduced the STOD13AS, a more energy-efficient power chip intended for mobile devices with active-matrix organic light-emitting diode displays. The part, now in volume production, will help extend the battery life of smartphones and other portable electronics. The chipmaker also unveiled the STCF04, a multifunction chip that the company said would provide more power to LED-based flashes in smartphone cameras.
As standard silicon-based power metal-oxide semiconductor field-effect transistors encounter performance challenges, chipmakers are turning to new types of chip packaging and wafer thinning to improve the parts, according to this analysis. Wafer-thinning techniques, which benefit the electrical characteristics of devices, have been used to make insulated gate bipolar transistors for the past decade, and now wafer thinning is extending to the larger wafers used to make power MOSFETs.
Hynix Semiconductor reported a net loss of $213 million for the fourth quarter as prices for DRAMs going into PCs continued to decline during the period. Analysts see better prospects for the company in boosting its production of NAND flash-memory devices, which are in higher demand for use in smartphones and tablet computers.
Nimbus Data Systems has introduced its E-Class Memory System, a solid-state drive entirely based on NAND flash-memory devices. The drive is intended for applications in consolidating data storage for database clusters, high-performance computing, virtual desktop infrastructure, virtualized server environments and Web infrastructure.
Chia Chau Wu, chairman of Nanya Technology, said his company has no plans to tie its memory chip-making operations with those of Elpida Memory and Micron Technology, and said he was unaware of any potential deal between Elpida and Micron. The debt-ridden Elpida is expected to post another loss for the financial year ending in March, its third unprofitable year in the past five years, amid declining demand and prices for DRAMs.