Winbond Electronics told investors Wednesday it would shift production of its specialty DRAMs to a 46-nanometer process and fabrication of its NOR flash memory devices to a 58nm process. The company plans to increase capacity for making NOR flash from 15,000 wafers a month to 17,000, while decreasing specialty DRAM capacity to 18,000 wafers a month from 20,000.

Full Story:

Related Summaries