2/7/2014

Qualcomm wants to provide every communications component inside smartphones, and although it has failed to crack the radio-frequency market, Executive Vice President Cristiano Amon believes more phone-makers will begin to adopt its year-old RF360 component. He cited the inclusion of a 3D circuit called the RF Pop that, when coupled with a Qualcomm baseband chip, supports up to 40 different 2G, 3G and 4G bands.

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