Arm's IoT Services Group, comprised of the IoT Platform and Treasure Data teams, will be transferred to the SoftBank Group, as Arm focuses on its semiconductor intellectual property business. "We can design the future of work around telecommuting to necessitate less travel, thereby lowering carbon emissions in enabling economic growth in remote areas, away from the established work hubs in big cities," Arm CEO Simon Segars says.
Synaptics agreed to acquire the Wireless IoT Connectivity business of Broadcom for about $250 million; the transaction is expected to close during the first quarter of Synaptics' fiscal year 2021. Michael Hurlston, president and CEO of Synaptics, said in a statement, "This acquisition complements Synaptics' ability to sell into a broad range of devices, such as IP cameras, smart displays, speakers, home automation and gaming consoles - all of which require cutting-edge technologies, including Wi-Fi 6 and 6E, Bluetooth 5.2 and GPS L5."
Taiwan Semiconductor Manufacturing Co. agreed to purchase all of the power production coming from Orsted's third offshore wind farm off the coast of Taiwan. The foundry over the next two decades will buy 920 megawatts of power from the wind farm project, which will be completed in 2025 or 2026.
Imagination Technologies' XS family of graphics processing units for driver assistance, 3D graphics displays and other automotive uses is ready, and the company says the GPUs are "the first licensable intellectual property to meet the car industry's ISO 26262 standard, which addresses risk levels in cars," Dean Takahashi writes. Separately, the company's Ethernet packet processor, which assists with secure routing of data in vehicle networks, has had its license renewed.
Continental, a large supplier of automotive electronics, will use the R-Car M3 system-on-a-chip device from Renesas Electronics for its first-generation Body High-Performance Computer. The Renesas SoC supports over-the-air software updates, which will be critical to automotive vehicles of the future.
Heterogeneous advanced packaging technology is causing challenges for IC testing, Bryon Moyer writes. Amy Leong of FormFactor says, "Cost of test is the big challenge for production."
Global microchip sales reached $35 billion in May, a 5.8% increase from a year earlier and up 1.5% from April of this year, the Semiconductor Industry Association reports. John Neuffer, the SIA's president and CEO, said in a statement, "The global semiconductor market in May remained largely resistant to the widespread economic disruptions caused by the COVID-19 pandemic, but there is still significant uncertainty for the months ahead."
While Semiconductor Manufacturing International Corp. stands to take in $7.5 billion from its new listing on the STAR stock market, the Chinese foundry has yet to demonstrate that it can compete with the likes of Taiwan Semiconductor Manufacturing Co. and Samsung Foundry, this analysis notes. SMIC's profit margins aren't promising, and US restrictions on the export of chipmaking technologies could hamper the foundry's potential growth, analysts note.
Researchers at the Samsung Advanced Institute of Technology collaborated with the Ulsan National Institute of Science and Technology and the University of Cambridge to come up with amorphous boron nitride, a semiconducting material. Samsung says this material may be suitable for manufacturing DRAMs and NAND flash memory devices.
Toshiba reports the development of a high-resolution, long-range light-receiving technology that could be used for making solid-state LiDAR chips without mechanical components. The company's high-efficiency silicon photo-multiplier may offer an alternative to microelectromechanical system technology in LiDAR devices for automotive applications and other uses.
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