Semiconductors
Top stories summarized by our editors
1/21/2019

Now that Toshiba Memory has completed its spinoff and the sale to an investor consortium led by Bain Capital, the chipmaker can focus on regaining its footing in the NAND flash memory market and possibly having an initial public offering during the latter half of this year, this analysis notes. Having mended its cooperative relationship with SanDisk/Western Digital, the company can deal with ordinary business issues, such as the declining prices for NAND flash.

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DigiTimes
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Toshiba
1/21/2019

Powertech Technology, Orient Semiconductor Electronics and other contract packagers of memory chips are benefiting from the significant drop in pricing for NAND flash memory devices, which is creating more demand for solid-state drives used in data centers, servers and smart notebook computers, industry sources say. PTI has reportedly received orders this year from Intel, Micron Technology and Toshiba Memory/Western Digital, sources say.

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DigiTimes
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Powertech Technology, PTI, Toshiba
1/21/2019

Researchers at the University of Twente in the Netherlands say they successfully connected different parts of an IC with an on-chip optical link. The tiny optocoupler circuit could possibly move data at 10 megabits per second in an energy-efficient fashion, they report.

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New Electronics
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University of Twente
1/21/2019

Western Digital brought out its WD Black SN750 NVMe solid-state drive for applications in gaming PCs, featuring a heat sink to keep the high-performance drive from overheating during game play. The second-generation SSD ranges in storage capacity from 250 gigabytes to 2 terabytes.

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VentureBeat
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Western Digital
1/21/2019

Qualcomm, in meetings during CES 2019, emphasized its role in connectivity and software engineering for autonomous-vehicle technology, this analysis notes. The chip design company said it will work with Ford Motor on developing cellular V2X technology.

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EE Times
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Qualcomm
1/21/2019

Artificial intelligence, deep learning, high-speed networking and telecommunications in data centers are creating new power-related issues in chip designs, this analysis notes. "Data center operators are now seeing the direct correlation between site-running costs and the thermal monitoring and management adopted way down deep within the system at chip level," Moortec Semiconductor CEO Stephen Crosher said.

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Stephen Crosher
1/18/2019

Mobile system-on-a-chip device suppliers are expected to start sampling their 5G-capable wares near the end of this year, a development that is expected to drive demand for foundries to make chips with 7-nanometer features, Digitimes Research predicts. While 7nm is the cutting edge in chip fabrication, most mobile SoCs are still made with a 28nm process.

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DigiTimes
1/18/2019

The value of semiconductor-related merger and acquisition agreements declined to $23.2 billion in last year, compared with $28.1 billion the year before and $107.3 billion in 2015, IC Insights reports. Still, the 2018 figure was greater than the annual averages reported in the first half of this decade, David Manners notes.

1/18/2019

Researchers in China have used graphene ink and a screen printing process to produce arrays of microsupercapacitors on substrates of flexible plastic or glass. The research team was able to make 130 microsupercapacitors in a series, providing more than 100 volts as a potential power source for electronics and flexible devices.

1/18/2019

Newark Element14 is stocking microelectromechanical system gyroscopes from Tronics Microsystems, a TDK division. The Gypro line is suitable for control and optical stabilization, motion tracking and precision navigation applications.

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Electronics360
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Tronics Microsystems, TDK