Semiconductors
Top stories summarized by our editors
11/15/2019

A survey taken at the Engineering Design Show in the UK found that 20% of respondents were concerned about political uncertainty, especially the effects of Brexit, and another 20% cited the challenge of finding new business. Eighteen percent said their organization was challenged in finding the right talent and skillsets.

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New Electronics
11/15/2019

Nvidia sees gains in chip sales for conversational artificial intelligence technology based in data centers. "Like Intel, Nvidia saw big demand from its hyperscale customers, undoubtedly driven by machine learning training and inference needs," says Patrick Moorhead of Moor Insights & Strategy.

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Reuters
11/15/2019

Huawei Technologies will soon market wireless devices built on its Kirin A1 chipset in India. These wearables include earphones, smart glasses and smartwatches.

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TechRadar (UK)
11/15/2019

Microsoft Azure cloud platform customers can now access Colossus intelligence processing units, Graphcore's artificial intelligence acceleration chips. The IPUs can be used in machine learning inference and training.

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EE Times
11/15/2019

Discrete devices have some advantages over integrated circuits, providing greater design flexibility, consultant Tolga Aydemir writes. "These devices require a deep understanding, experience and creativity in electronics and physics, and can also add considerably to design and development timescales and costs compared with integrated solutions," he notes.

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New Electronics
11/15/2019

Figuring out corner cases that could lead to the failure of a system-on-a-chip device design is becoming a significant challenge, this analysis notes. Neil Hand of Mentor, a Siemens Business, says, "It becomes a lot harder to define for SoCs, and this is what makes it an interesting discussion."

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Neil Hand, Siemens Business
11/14/2019

Foxconn Technology Group, one of the world's largest contract electronics manufacturers, is changing into more of a technology services provider to address market requirements for electric vehicles, digital health and robotics, using 5G/6G mobile communications, artificial intelligence and advanced semiconductors, says Young Liu, Foxconn's chairman. Speaking at an investors conference, Liu noted that Foxconn will not produce EVs, but it will provide chassis and other modules as part of an EV technology platform.

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DigiTimes
11/14/2019

ASML CEO Peter Wennink says manufacturers of high-end microchips will provide robust demand for his company's lithography systems and other semiconductor production equipment next year, while memory vendors are less likely to buy IC gear in 2020. "Logic is strong, that will extend into 2020, we don't see any relief of that pressure," he said at an investment conference.

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Reuters
11/14/2019

Researchers at Russia's Skolkovo Institute of Technology report their development of a potassium-ion battery design. "We showed that electroactive organic materials can pave the way for a new generation of electrochemical energy storage devices combining the advantages of metal-ion batteries and supercapacitors," said Pavel Troshin, the research group leader.

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PV Magazine (Germany)
11/14/2019

NXP Semiconductors unveiled the NXP NCJ29D5 ultra-wideband chip that would enable smartphone users to unlock vehicles with their phones. Meanwhile, BMW is working with the Car Connectivity Consortium to develop the next-generation Digital Key 3.0 specification with UWB technology.

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EE Times