Semiconductors
Top stories summarized by our editors
5/24/2019

CC Wei, the CEO of Taiwan Semiconductor Manufacturing Co., said the foundry has initiated volume production of chips with its 7-nanometer N7+ process technology, its first node involving extreme ultraviolet lithography. Meanwhile, TSMC said it is complying with international trade rules by supplying wafers and technologies to Huawei Technologies, despite US restrictions on the Chinese telecom vendor.

5/24/2019

Having lost its case before a federal court in San Jose, Calif., Qualcomm is hoping for a quick appeal of the ruling supporting the Federal Trade Commission's allegations of the chip design company's monopolistic business practices. It also hopes that the Trump administration will support the company, which is developing 5G cellular communications technology.

5/24/2019

Spirox completed an agreement with National Instruments to sell NI's semiconductor test systems in the Greater China region, which includes Taiwan. Spirox was an exclusive sales agent for Xcerra in Greater China but terms of that deal ended in March.

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DigiTimes
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Spirox, National Instruments
5/24/2019

STMicroelectronics is collaborating with Gaia Smart Cities Solutions in support of the Clean India Mission rolled out by the government of Prime Minister Narendra Modi in 2014. The partners are working on a smart feedback system for citizens to rate the cleanliness of public utilities.

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New Electronics
5/24/2019

Mentor, a Siemens business, is offering IC design tools with artificial intelligence technology to enhance the design and verification of AI-based chips. The electronic design automation vendor is providing the Calibre Machine Learning OPC and Calibre LFD with Machine Learning tools for design tasks.

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EE Times
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Siemens
5/24/2019

Advanced packaging technology can be brought to bear on partitioning of chips with 3D integration elements, this analysis notes. GlobalFoundries' Dingyou Zhang asserts that thermal and electrical proximity are tied together.

5/23/2019

Silicon carbide-based devices are in high demand for electric vehicles and other power applications, outstripping supply of SiC chips and wafers, Mark LaPedus writes. Cree is pumping $1 billion into efforts to boost its SiC fabrication and wafer capacities, while developing a 200-millimeter wafer fabrication facility for SiC production.

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SiC, Mark LaPedus, Cree
5/23/2019

With the pending $740 million sale of Avera Semiconductor, its application-specific integrated circuit business, GlobalFoundries is re-emphasizing its core foundry business, especially in 5G infrastructure and base stations, this analysis notes. GlobalFoundries announced deals this year to offload select assets to ON Semiconductor and Vanguard International Semiconductor.

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DigiTimes
5/23/2019

To resolve the issue of greater resistance of copper and silicon in ever-shrinking chip dimensions, scientists in South Korea are demonstrating how a combination of graphene and amorphous carbon could boost the device concentration of graphene and enhance the 2D carbon material's electrical characteristics. Graphene boasts electric conductivity 100 times greater than copper and electron mobility 100 times better than silicon.

5/23/2019

Toshiba reports having nine high-current photorelays that carry UL 508 certification. The devices can be used in building automation and industrial applications.

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Toshiba