Semiconductors
Top stories summarized by our editors
9/23/2019

Samsung Electronics is keeping up its connections with Japanese suppliers of semiconductor and display materials, despite the trade conflict between Japan and South Korea, the Nikkei reports. Those Japanese manufacturers informed Samsung that the status quo in supply and trade was being maintained, as long as the usual paperwork was completed.

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Samsung, Samsung Electronics
9/23/2019

North American suppliers of semiconductor production equipment posted billings of $2 billion during August, down 1.4% from July's revised $2.03 billion and 10.5% lower than the billings of $2.23 billion in August 2018, SEMI reports. Ajit Manocha, president and CEO of SEMI, said in a statement, "[E]ven though the industry is facing headwinds, monthly billings levels have remained above $2 billion for the past four months."

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DigiTimes
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SEMI, SEMI, Ajit Manocha
9/23/2019

SK Group plans to spend $10 billion on US operations during the next three years, after investing $5 billion in the past three years. The South Korean conglomerate is building an electric vehicle battery factory in Georgia for $1.7 billion, among other investments.

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SK Group
9/23/2019

Google made 18 agreements to supply its worldwide data centers with renewable energy, the company says. In the US, it will purchase power from solar farms in Texas, North Carolina and South Carolina.

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Google
9/23/2019

Western Digital is incorporating 3D NAND flash memory devices in its rugged e.MMC cards, MicroSD devices and SD cards. The e.MMC iNAND EM132 EFD chips can store up to 256 gigabytes of data.

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Electronic Design
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Western Digital
9/23/2019

Intel, Taiwan Semiconductor Manufacturing Co. and other chipmakers are turning to copper-to-copper hybrid bonding interconnects as they improve 2.5D and 3D IC packaging technology, Mark LaPedus writes. "A number of organizations and companies are planning to adopt direct bond interconnect or hybrid bonding as they get to 20μm to 10μm and below pitches," said Jan Vardaman, president of TechSearch International.

9/20/2019

A delegation of semiconductor executives met with Tsai Ing-wen, the president of Taiwan, to advocate for more government spending on basic research and on training of future employees in the microchip industry. Tsai pointed to the 5+2 Industry Transformation project for nurturing talent, a joint effort of academia, government and industry.

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DigiTimes
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Tsai Ing-Wen
9/20/2019

MediaTek reports investing $3.23 billion on developing technology for 5G cellular communications. For the past three years, the chip design company has devoted between 20% and 30% of its research and development budget annually to 5G technology.

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MediaTek
9/20/2019

Dialog Semiconductor brought out the DA9217, DA9220, DA9121 and the DA9122 power management ICs, buck converters with a 4-megahertz switching frequency. The sub-PMIC product line is meant to work with Arm Cortex-based multi-core application processors and with high-performance field-programmable gate arrays, graphics processing units and system-on-a-chip devices.

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New Electronics
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Dialog Semiconductor
9/20/2019

Intel initiated shipments of its Stratix 10 DX field-programmable gate arrays. The FPGAs support Intel Ultra Path Interconnect, a new controller for Intel's Optane memory technology and PCI-Express Gen4 x16.

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New Electronics
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Intel