The concept of printed electronics has been in research and development for years, and that work is finally paying off on multiple fronts, this analysis notes. "Anytime you need a flexible form factor that can be adjusted to fit a particular shape, this works great," said Dan Brewer of Brewer Science.
Arm's predictions for the internet of things in the new year include the mainstreaming of home automation, personalized delivery and improved health care service. The company also commissioned a survey of 2,000 consumers by NorthStar, getting their opinions about 5G, artificial intelligence, IoT and machine learning.
Taiwan's Intellectual Property Court denied two applications for preliminary injunctions against Novatek Microelectronics submitted by a competitor, FocalTech Electronics. FocalTech claimed that Novatek's NT36672 and NT36525 chips, known as touch controllers with display driver integration mostly used in smartphones, infringed a patent held by FocalTech.
November consolidated revenues for both Taiwan Semiconductor Manufacturing Co. and United Microelectronics were slightly down from October, while Vanguard International Semiconductor posted a monthly gain of 2.4%. On a year-to-year basis, TSMC's November revenues increased 5.6% to $3.19 billion.
Researchers in the US report the potential development of room-temperature fluorine-ion batteries using a liquid electrolyte discovered at the Jet Propulsion Laboratory. The research team ran computer simulations on the anion-based rechargeable battery, which they say could be an alternative to lithium-ion batteries.
Imec reports that spin-transfer torque magnetoresistive random-access memories now favorably compare with static RAMs for last-level caches used in high-performance computing. The research institution also found that STT-MRAMs offer significant energy gains compared with SRAMs.
Advanced packaging technologies, such as 2.5D, 3D, fan-out and system-in-package, are seen continuing to advance in adoption during 2019, although trade tensions between China and the US have some IC packaging firms rethinking their investments in Chinese facilities, Mark LaPedus writes. Santosh Kumar, principal analyst at Yole Developpement, sees a packaging market slowdown for 2019, happening throughout the course of the year.
Taiwan Semiconductor Manufacturing Co. will construct an 8-inch wafer fabrication facility in Tainan, Taiwan, to address demand for mature and specialty technologies. The foundry hasn't built an 8-inch fab in around 15 years, yet the world market has been clamoring for more 8-inch production capacity to make chips with older processes.
The Samsung Group promoted 158 executives in preparation for 2019, down from 221 promotions a year ago. Among the senior ranks of management, the company promoted Kim Ki-nam, CEO of Samsung's device solutions division and chairman of the Samsung Advanced Institute of Technology, to vice chairman of the conglomerate, while Roh Tae-moon, executive vice president and head of R&D at the mobile communications business, was promoted to president of the smartphone unit.
Broadcom reported fiscal fourth quarter and full-year results that topped analyst estimates for the period, while forecasting revenue of $24.5 billion for the current fiscal year, including CA Technologies, the software company acquired last month. Broadcom's wireless communications business saw its quarterly revenue fall 5% from a year earlier to $1.7 billion, reflecting what CEO Hock Tan called a "downtick" in wireless chip orders from Apple and other customers.