Cell-aware testing, a semiconductor testing approach first described a decade ago, has led to other methods beyond the standard chip testing, this analysis notes. Device-aware testing and variation-aware testing technology was described at the International Test Conference in Washington, D.C., expanding the field of testing in context.
While digital twins are developed during the design process, there is no current equivalent for the testing process, Ed Sperling writes. John O'Donnell, CEO of yieldHUB, says, "We need better methods for parsing and cleaning data, applying machine learning as early as characterization, enriching yield databases with manufacturing execution system data and other data sources, including environmental and genealogical."
IBM's Erin O'Connor says asserts electronic design engineers have to not only take into account hardware, software, and connectivity as they design systems, but they "also have to design for data." She adds, "Although the world will not slow down as consumers continue to demand and buy connected products, it offers a gateway to smart devices, and the ability for engineers to leverage resources on a global scale--allowing them to focus on design and produce incredible products that are yet to be imagined."
Low-temperature co-fired ceramics stand to succeed liquid crystal polymers as the preferred material for packaging 5G millimeter-wave transmission modules, industry sources say. LCP has been the organic material of choice up to now, yet LTCC is expected to mature as a material for volume production in 2020, those sources note.
Seven European nations will conduct research into battery technology under a $3.53 billion program funded by the European Commission. The decade-long program is expected to attract about $5.5 billion in private investment.
Researchers at the Oak Ridge National Laboratory are working on ways to repurpose lithium-ion batteries used in electric vehicles as residential power sources. Imre Gyuk of the US Department of Energy says, "This project also supports a circular economy by reusing a valuable commodity, minimizing waste, and ensuring reliable, secure delivery of electricity for a robust economy."
Molybdenum disulfide is proving to be a suitable 2D semiconductor material for scaled transistors, imec reports. "Although still an order of magnitude away from Si transistors, we have brought our MOSFET devices into a realm where they show promising performance for future logic and memory applications," imec's Iuliana Radu says.
UltraSoC is contributing an open-source implementation of its RISC-V trace encoder through the OpenHW Group to support the development of an open, commercial-grade ecosystem for open-source processors. UltraSoC CEO Rupert Baines says, "We fully believe in industry standards and the importance of open source; by donating this encoder, we can help industry adoption of RISC-V, strengthen the ecosystem and support compatibility and consistency."
Suppliers of semiconductor manufacturing equipment and silicon wafers in Taiwan stand to see stronger sales in the new year, especially those vendors in Taiwan Semiconductor Manufacturing Co.'s supply chain. Doris Hsu, chairwoman of GlobalWafers, says client demand for wafers is firming up in this quarter and stands to improve during the first six months of 2020.
Sales of NAND flash memory devices will increase 19% next year when compared with 2019, and DRAM sales will get a 12% boost, IC Insights forecasts. Automotive microchips and special-purpose logic ICs will see 13% growth next year, while display drivers and embedded microprocessors each will be up 10%, the market research firm predicts.