System-on-a-chip devices must be surrounded by passives and power management ICs to be incorporated in system designs, this analysis notes. The industry drive to miniaturization is better realized through system-in-package technology, which combines all of the necessary components in one package, it is said.
United Microelectronics, indicted in the US this month for allegedly stealing DRAM technology secrets from Micron Technology, insists its DRAM designs are significantly different from those of Micron. The Taiwan-based foundry said in a statement that it "will vigorously defend itself against any false charges and misconceived allegations."
Artificial intelligence is the top trending topic for the internet of things, Gartner says, noting that 14.2 billion connected devices will be operating next year, rising to 25 billion by 2021. Other leading IoT trends include data brokering and infonomics, intelligent mesh technology taking over from the intelligent edge, innovation in sensors, trusted hardware and operating systems, new architectures in silicon-based chips and more wireless networking.
Infineon Technologies forecasts its revenue in the 2018/19 business year will grow 9% to 13%, largely thanks to its automotive chip division, although global economic conditions may turn averse, and the company increased provisions for its bankrupt Qimonda memory chip unit by $179 million. Meanwhile, Infineon acquired Dresden, Germany-based Siltectra, a startup with material technology that could double the number of silicon carbide chips from one SiC wafer.
SK Hynix says it has come up with a second-generation 10-nanometer-class process for fabricating DD4 DRAMs with greater energy efficiency and improved productivity. Volume production with the new process will begin in the first quarter of next year, the company adds.
Researchers in Germany report that bilayer graphene has the potential to become a superconductor, saying the 2D carbon material has greater current conductivity than previously known to scientists. The team used a high-resolution form of angle-resolved photoemission spectroscopy to scan the band structure of bilayer graphene.
"Compute is going to happen in a lot more places than it does today," Mike Muller, Arm's chief technology officer, says in this interview. He adds, "Basically, the server is moving out of the cloud, into the network and down into the device."
Suppliers of power metal-oxide-semiconductor field-effect transistors in Taiwan are looking warily at demand for their products for the rest of this year and in 2019, although foundries are making more capacity available for production of MOSFETs and other chips, industry sources say. MOSFET supply tightened in 2017, which led to vendors raising their prices; it's unclear whether those higher prices will continue next year, those sources note.
Researchers at the University of California at Berkeley developed a flexible organic light-emitting diode array that can measure blood oxygen levels differently than the oximeter finger clips in use at present. The research was financially supported by Cambridge Display Technology and by Intel through a Semiconductor Research Corp. grant.