Advanced Micro Devices showed off its first 7-nanometer CPU and GPU with results comparable to that of Intel's 14-nm chip and Nvidia's 16-nm chip. The GPUs are designed to target machine learning, rendering applications and high-performance computing while the CPU is aimed at being competitive with the comparable offerings from Intel.
Microchip Technology introduced the DSC613 microelectromechanical system clock generator, which is said to be capable of replacing up to three crystals and oscillators on a printed circuit board. The multi-output MEMS clock generator line can be used in internet of things and portable electronic devices.
While cyberattacks are a growing concern, the cybersecurity of many devices is improving, this analysis notes. Helena Handschuh of Rambus says, "Now the question is how we evolve that so that we can build systems that are connected but secure, because there are more and more connected systems."
China's manufacturers of silicon crystal-growing furnaces for photovoltaic solar cells are turning to the domestic semiconductor industry for growth prospects, industry sources say. Wafer Works of Taiwan equipped its new 8-inch wafer factory in Zhengzhou, China, with crystal-growing furnaces from Jingsheng Mechanical & Electrical, the sources note.
Tadanobu Fujiwara, president of Rohm Semiconductor, says the key to the company's continued success is paying attention to its market segments. "We decide what products to sell based on the customers' point of view," he says, noting the company works to maximize its strengths.
ON Semiconductor is becoming a supplier to the Mercedes-AMG Petronas Motorsport and Mercedes EQ Formula E teams, collaborating with the Mercedes EQ Formula E team on developing next-generation electric powertrains. ON Semi's David Somo said, "This partnership showcases our full range of power semiconductors and modules in supporting the continuing success of Mercedes-AMG Petronas Motorsport as part of a demanding and dynamic sport."
Researchers at Iowa State University and the University of Florida are working on flexible, low-cost nitrogen sensors that can be buried in soil and tie into wireless networks to report on the concentration of fertilizer in the soil. The team will first focus on surrounding tomato plants with the bury-and-forget sensors to collect high-resolution spatial and temporal nitrogen data.
Imec reports developing a time-delay-integration imager using a charge-coupled device in complementary metal-oxide-semiconductor technology. The high-speed, ultraviolet-sensitive imager can be used in industrial machine vision applications, such as inspection in semiconductor fabrication.
Panel-level fan-out packaging for semiconductors is seeing wider industry adoption, although cost and technical issues remain for the technology, Mark LaPedus writes. Jan Vardaman of TechSearch International said, "You need a single product with high volumes to justify panel, so we might not need it until 2020 for most applications."
SK Hynix introduced a 96-layer, 512-gigabit 4D flash memory device incorporating 3D charge trap flash design with peri. under cell technology. Volume production of the memory will begin before the end of this year, with the company later expanding production to meet customer demand.