Taiwan Semiconductor Manufacturing Co. is expected to put its 3-nanometer process technology into volume production during the latter half of 2022, making chips meant for use in Mac computers or iPhones, industry sources report. Meanwhile, TSMC will offer up to a total of $9 billion in bonds for funding the foundry's 12-inch wafer fabrication facility in Arizona, which is currently under construction.

Apple will be one of the first to use Taiwan Semiconductor Manufacturing Corp.'s 3-nanometer chip, beginning next year, likely starting with the iPad followed by the iPhone. Also using the chip will be Intel for notebook PC processors and data center CPUs and Graphcore, which will leverage the technology to produce a processor with more than 100 billion transistors.

Taiwan Semiconductor Manufacturing Co. plans to start fabricating microchips with 3-nanometer features later this year, with an eye toward volume production in 2022, Chuong Nguyen writes. Apple's A-series processors next year could be among the first components to take advantage of the next-generation process technology.

Taiwan Semiconductor Manufacturing Co. reports it will use extreme ultraviolet lithography systems to fabricate microchips with 3-nanometer features, as it has done for its 7nm, 6nm and 5nm process nodes. The foundry will offer customers the option to use a 4nm process, available in 2022, as a transition from 5nm to 3nm.

Morris Chang, founder and chairman of Taiwan Semiconductor Manufacturing Co., announced his plan to retire in June. Co-CEO Mark Liu will succeed him as chairman, while co-CEO C.C. Wei will have the CEO post to himself in the succession. Meanwhile, TSMC said it will go ahead with construction of a $15.7 billion wafer fabrication facility in Taiwan's Tainan Science Park, capable of making chips with 3-nanometer features.